NXP Semiconductors OL2381AHN

表面安装

YES

Contact plating

gold-plated

Number of pins

17

终端数量

32

Rohs Code

有

Part Life Cycle Code

活跃

Ihs Manufacturer

NXP SEMICONDUCTORS

Part Package Code

QFN

Package Description

5 X 5 MM, 0.85 MM HEIGHT, LEAD FREE, PLASTIC, MO-220, SOT617-3, HVQFN-32

Operating Temperature-Max

85 °C

Operating Temperature-Min

-25 °C

Package Body Material

PLASTIC/EPOXY

Package Code

HQCCN

Package Shape

SQUARE

Package Style

CHIP CARRIER, HEAT SINK/SLUG

Supply Voltage-Nom

2.7 V

Type of connector

pin strips

Connector

socket

Kind of connector

female

Spatial orientation

straight

Contacts pitch

2.54mm

Electrical mounting

THT

Connector pinout layout

1x17

Gross weight

0.99 g

Operating temperature

-40...163°C

JESD-609代码

e4

无铅代码

有

端子表面处理

Nickel/Palladium/Gold (Ni/Pd/Au)

HTS代码

8542.39.00.01

端子位置

QUAD

终端形式

无铅

峰值回流焊温度（摄氏度）

未说明

功能数量

1

端子间距

0.5 mm

Reach合规守则

compliant

Current rating

1.5A

时间@峰值回流温度-最大值(s)

未说明

引脚数量

32

JESD-30代码

S-PQCC-N32

温度等级

OTHER

通信IC类型

电信电路

Rated voltage

60V

个人资料

beryllium copper

饱和电流

3

长度

5 mm

宽度

5 mm

Plating thickness

0.75µm

Flammability rating

UL94V-0