NXP Semiconductors PBHV8140Z,115

表面安装

YES

外壳材料

1

Switching Scheme

ON-OFF, SPST

Number of Contacts in Group/ Number of Groups (Total Contacts)

3/ 1 (3P)

Number of Switching Cycles (Electrical)

10000 Min

Transport Packaging Size/Quantity

51*14*30/500

Gross Weight

1.14

Operating Temperature-Max

150 °C

Manufacturer Package Code

SOT223

Part Package Code

SC-73

Ihs Manufacturer

NXP SEMICONDUCTORS

Part Life Cycle Code

Transferred

Rohs Code

有

Capacitors series

KGM

Case - mm

1608

Case - inch

0603

Mounting

SMD

Kind of capacitor

MLCC

Type of capacitor

ceramic

Operating temperature

-55...125°C

容差

±10%

JESD-609代码

e3

ECCN 代码

EAR99

端子表面处理

TIN

电容量

0.47nF

峰值回流焊温度（摄氏度）

260

深度

8 mm

Reach合规守则

compliant

时间@峰值回流温度-最大值(s)

30

引脚数量

4

电介质

X7R

配置

SINGLE

注意

Waterproof

开关类型

Hermetically Sealed Microswitch

极性/通道类型

NPN

工作温度范围

-25…+85 °C

额定电流

1.5 (3) A

切换电压

250 (125) V

最大耗散功率(Abs)

1.45 W

集电极电流-最大值(IC)

1 A

最小直流增益（hFE）

10

饱和电流

1

Operating voltage

50V

宽度

5.5 mm