NXP Semiconductors PCA9555DB/G

表面安装

YES

终端数量

24

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NXP SEMICONDUCTORS

Package Description

SSOP,

Clock Frequency-Max

0.4 MHz

Number of I/O Lines

16

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

SSOP

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE, SHRINK PITCH

Supply Voltage-Max

5.5 V

Supply Voltage-Min

2.3 V

Supply Voltage-Nom

3 V

JESD-609代码

e4

ECCN 代码

EAR99

端子表面处理

镍钯金

HTS代码

8542.39.00.01

端子位置

DUAL

终端形式

鸥翼

端子间距

0.65 mm

Reach合规守则

unknown

JESD-30代码

R-PDSO-G24

温度等级

INDUSTRIAL

端口的数量

2

uPs/uCs/外围ICs类型

PARALLEL IO PORT, GENERAL PURPOSE

座位高度-最大

2 mm

长度

8.2 mm

宽度

5.3 mm