NXP Semiconductors PCAL6416AEX

表面安装

YES

终端数量

24

Rohs Code

有

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NXP SEMICONDUCTORS

Package Description

XFBGA-24

Clock Frequency-Max

0.4 MHz

Moisture Sensitivity Levels

1

Number of I/O Lines

16

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

VFBGA

Package Shape

SQUARE

Package Style

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Supply Voltage-Max

5.5 V

Supply Voltage-Min

1.65 V

Supply Voltage-Nom

1.8 V

ECCN 代码

EAR99

HTS代码

8542.39.00.01

端子位置

BOTTOM

终端形式

BALL

端子间距

0.4 mm

Reach合规守则

unknown

JESD-30代码

S-PBGA-B24

温度等级

INDUSTRIAL

端口的数量

2

uPs/uCs/外围ICs类型

PARALLEL IO PORT, GENERAL PURPOSE

座位高度-最大

0.5 mm

长度

2 mm

宽度

2 mm