NXP Semiconductors PLHS18P8A/BRA

表面安装

NO

终端数量

20

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NXP SEMICONDUCTORS

Part Package Code

DIP

Package Description

0.300 INCH, CERAMIC, DIP-20

Number of I/O Lines

8

Package Body Material

CERAMIC, METAL-SEALED COFIRED

Package Code

DIP

Package Equivalence Code

DIP20,.3

Package Shape

RECTANGULAR

Package Style

IN-LINE

HTS代码

8542.39.00.01

端子位置

DUAL

终端形式

THROUGH-HOLE

Reach合规守则

unknown

引脚数量

20

JESD-30代码

R-CDIP-T20

资历状况

不合格

传播延迟

30 ns

组织结构

10 DEDICATED INPUTS, 8 I/O

可编程逻辑类型

OT PLD

专用输入数量

10