NXP Semiconductors PMPB20XPE

表面安装

YES

Contact plating

gold-plated

Number of pins

2

终端数量

6

晶体管元件材料

SILICON

外壳材料

1

Rohs Code

有

Part Life Cycle Code

Transferred

Ihs Manufacturer

NXP SEMICONDUCTORS

Package Description

2 X 2 MM, 0.65 MM HEIGHT, LEADLESS, ULTRA THIN, PLASTIC, DFN2020MD-6, 6 PIN

Drain Current-Max (ID)

7.2 A

Package Body Material

PLASTIC/EPOXY

Package Shape

SQUARE

Package Style

小概要

Type of connector

pin strips

Connector

socket

Kind of connector

female

Spatial orientation

straight

Contacts pitch

2.54mm

Electrical mounting

THT

Connector pinout layout

1x2

Gross weight

0.12 g

Operating temperature

-40...163°C

JESD-609代码

e3

ECCN 代码

EAR99

端子表面处理

TIN

端子位置

DUAL

终端形式

无铅

Reach合规守则

unknown

Current rating

1.5A

参考标准

IEC-60134

JESD-30代码

S-PDSO-N6

配置

SINGLE WITH BUILT-IN DIODE

操作模式

增强型MOSFET

箱体转运

DRAIN

晶体管应用

SWITCHING

极性/通道类型

P-CHANNEL

漏极-源极导通最大电阻

0.0235 Ω

脉冲漏极电流-最大值(IDM)

30 A

DS 击穿电压-最小值

20 V

场效应管技术

METAL-OXIDE SEMICONDUCTOR

Rated voltage

60V

个人资料

beryllium copper

饱和电流

1

Plating thickness

0.75µm

Flammability rating

UL94V-0