NXP Semiconductors SC18IS602BIPW/S8

Contact plating

gold-plated

表面安装

YES

Number of pins

72

终端数量

16

Type of connector

pin strips

Connector

socket

Kind of connector

female

Spatial orientation

straight

Contacts pitch

2.54mm

Electrical mounting

THT

Connector pinout layout

2x36

Row pitch

2.54mm

Gross weight

4.32 g

Rohs Code

有

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NXP SEMICONDUCTORS

Package Description

TSSOP,

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

TSSOP

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Supply Voltage-Max

3.6 V

Supply Voltage-Min

2.4 V

Supply Voltage-Nom

3 V

Operating temperature

-40...163°C

JESD-609代码

e4

端子表面处理

镍钯金

HTS代码

8542.31.00.01

端子位置

DUAL

终端形式

鸥翼

峰值回流焊温度（摄氏度）

260

端子间距

0.65 mm

Reach合规守则

compliant

Current rating

1.5A

时间@峰值回流温度-最大值(s)

30

JESD-30代码

R-PDSO-G16

温度等级

INDUSTRIAL

uPs/uCs/外围ICs类型

BUS CONTROLLER, I2C

座位高度-最大

1.1 mm

Rated voltage

60V

总线兼容性

I2C

最大数据传输率

0.225 MBps

个人资料

beryllium copper

饱和电流

1

长度

5 mm

宽度

4.4 mm

Plating thickness

0.75µm

Flammability rating

UL94V-0