NXP Semiconductors SE97TP

表面安装

YES

越来越多的功能

SURFACE MOUNT

终端数量

8

Rohs Code

有

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NXP SEMICONDUCTORS

Package Description

3 X 2 MM, 0.80 MM HEIGHT, PLASTIC, MO-229, SOT-1069, HWSON-8

Accuracy-Max (Cel)

3 Cel

Operating Temperature-Max

125 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

SOLCC8,.11,20

Package Shape/Style

RECTANGULAR

Supply Voltage-Max

3.6 V

Supply Voltage-Min

3 V

JESD-609代码

e3

端子表面处理

Matte Tin (Sn)

Reach合规守则

unknown

本体长度/直径

3 mm

本体宽度

2 mm

终端类型

SOLDER

比特数

11

传感器/传感器类型

TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL

房屋

PLASTIC

输出接口类型

2-WIRE INTERFACE

工作电流-最大值

0.4 mA

本体高度

0.8 mm