NXP Semiconductors SJA1105PEL

Contact plating

gold-plated

表面安装

YES

Number of pins

10

终端数量

159

Type of connector

pin strips

Connector

socket

Kind of connector

female

Spatial orientation

straight

Contacts pitch

2.54mm

Electrical mounting

SMT

Connector pinout layout

1x10

Gross weight

0.57 g

Part Life Cycle Code

活跃

Ihs Manufacturer

NXP SEMICONDUCTORS

Package Description

BGA,

Operating Temperature-Max

105 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

LFBGA

Package Equivalence Code

BGA159,14X14,32

Package Shape

SQUARE

Package Style

GRID ARRAY, LOW PROFILE, FINE PITCH

Supply Voltage-Nom

1.2 V

Operating temperature

-40...163°C

HTS代码

8542.39.00.01

端子位置

BOTTOM

终端形式

BALL

功能数量

1

端子间距

0.8 mm

Reach合规守则

unknown

Current rating

3A

JESD-30代码

S-PBGA-B159

温度等级

INDUSTRIAL

电源电流-最大值

200 mA

座位高度-最大

1.5 mm

筛选水平

AEC-Q100; ISO 26262

通信IC类型

ETHERNET SWITCH

Rated voltage

150V

个人资料

beryllium copper

长度

12 mm

宽度

12 mm

Plating thickness

0.75µm

Flammability rating

UL94V-0