NXP Semiconductors TDA8933BTW/N2

表面安装

YES

终端数量

32

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NXP SEMICONDUCTORS

Package Description

TSSOP, TSSOP32,.3

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

TSSOP

Package Equivalence Code

TSSOP32,.3

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

ECCN 代码

EAR99

HTS代码

8542.33.00.01

端子位置

DUAL

终端形式

鸥翼

端子间距

0.635 mm

Reach合规守则

unknown

JESD-30代码

R-PDSO-G32

资历状况

不合格

温度等级

INDUSTRIAL

电源电流-最大值

50 mA

消费者集成电路类型

音频放大器