NXP Semiconductors TEA2208T/1

Contact plating

gold-plated

表面安装

YES

Number of pins

40

终端数量

14

Type of connector

pin strips

Connector

socket

Kind of connector

female

Spatial orientation

straight

Contacts pitch

2.54mm

Electrical mounting

THT

Connector pinout layout

2x20

Row pitch

2.54mm

Gross weight

2.16 g

Part Life Cycle Code

活跃

Ihs Manufacturer

NXP SEMICONDUCTORS

Package Description

,

Operating Temperature-Max

125 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

SOP

Package Equivalence Code

SOP14,.25

Package Shape

RECTANGULAR

Package Style

小概要

Supply Voltage-Nom (Vsup)

12 V

Operating temperature

-40...163°C

HTS代码

8542.39.00.01

端子位置

DUAL

终端形式

鸥翼

功能数量

1

端子间距

1.27 mm

Reach合规守则

unknown

Current rating

1.5A

JESD-30代码

R-PDSO-G14

通道数量

1

模拟 IC - 其他类型

模拟电路

座位高度-最大

1.75 mm

Rated voltage

60V

个人资料

beryllium copper

长度

8.65 mm

宽度

3.9 mm

Plating thickness

0.75µm

Flammability rating

UL94V-0