NXP Semiconductors TFF11092HN

表面安装

YES

终端数量

24

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NXP SEMICONDUCTORS

Package Description

4 X 4 MM, 0.85 MM HEIGHT, PLASTIC, MO-220, SOT616-1, HVQFN-24

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

HVQCCN

Package Shape

SQUARE

Package Style

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Supply Voltage-Nom

3.3 V

HTS代码

8542.39.00.01

端子位置

QUAD

终端形式

无铅

功能数量

1

端子间距

0.5 mm

Reach合规守则

unknown

JESD-30代码

S-PQCC-N24

温度等级

INDUSTRIAL

座位高度-最大

1 mm

通信IC类型

电信电路

长度

4 mm

宽度

4 mm