NXP Semiconductors TJA1027TK/20

表面安装

YES

Contact plating

gold-plated

Number of pins

4

终端数量

8

Rohs Code

有

Part Life Cycle Code

活跃

Ihs Manufacturer

NXP SEMICONDUCTORS

Part Package Code

SON

Package Description

3 X 3 MM, 0.85 MM HEIGHT, GREEN, PLASTIC, MO-229, SOT782-1, HVSON-8

Package Body Material

PLASTIC/EPOXY

Package Code

HVSON

Package Shape

SQUARE

Package Style

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Supply Voltage-Nom

12 V

Type of connector

pin strips

Connector

socket

Kind of connector

female

Spatial orientation

straight

Contacts pitch

2.54mm

Electrical mounting

THT

Connector pinout layout

1x4

Gross weight

0.2 g

Operating temperature

-40...163°C

HTS代码

8542.39.00.01

端子位置

DUAL

终端形式

无铅

峰值回流焊温度（摄氏度）

260

功能数量

1

端子间距

0.65 mm

Reach合规守则

compliant

Current rating

3A

时间@峰值回流温度-最大值(s)

30

引脚数量

8

JESD-30代码

S-PDSO-N8

座位高度-最大

1 mm

通信IC类型

电路接口

Rated voltage

150V

个人资料

beryllium copper

饱和电流

1

长度

3 mm

宽度

3 mm

Plating thickness

0.75µm

Flammability rating

UL94V-0