NXP Semiconductors TJA1044GTK

表面安装

YES

Contact plating

gold-plated

Number of pins

60

终端数量

8

Rohs Code

有

Part Life Cycle Code

活跃

Ihs Manufacturer

NXP SEMICONDUCTORS

Package Description

HVSON-8

Operating Temperature-Max

150 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

HVSON

Package Equivalence Code

SOLCC8,.12,25

Package Shape

SQUARE

Package Style

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Supply Voltage-Nom

5 V

Type of connector

pin strips

Connector

socket

Kind of connector

female

Spatial orientation

straight

Contacts pitch

2.54mm

Electrical mounting

THT

Connector pinout layout

2x30

Row pitch

2.54mm

Gross weight

3.6 g

Operating temperature

-40...163°C

ECCN 代码

EAR99

附加功能

ESD on pins CANH and CANL ESD is 8kV

HTS代码

8542.39.00.01

端子位置

DUAL

终端形式

无铅

峰值回流焊温度（摄氏度）

未说明

功能数量

1

端子间距

0.65 mm

Reach合规守则

compliant

Current rating

1.5A

时间@峰值回流温度-最大值(s)

未说明

JESD-30代码

S-PDSO-N8

电源电流-最大值

110 mA

数据率

5000 Mbps

座位高度-最大

1 mm

筛选水平

AEC-Q100

通信IC类型

电路接口

收发器数量

1

Rated voltage

60V

个人资料

beryllium copper

长度

3 mm

宽度

3 mm

Plating thickness

0.75µm

Flammability rating

UL94V-0