NXP Semiconductors TJA1145TK/FD

表面安装

YES

Contact plating

gold-plated

Number of pins

18

终端数量

14

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NXP SEMICONDUCTORS

Package Description

HVQCCN, SOLCC14,.12X.18,25

Package Body Material

PLASTIC/EPOXY

Package Code

HVQCCN

Package Equivalence Code

SOLCC14,.12X.18,25

Package Shape

RECTANGULAR

Package Style

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Supply Voltage-Max

5.5 V

Supply Voltage-Min

4.5 V

Supply Voltage-Nom

5 V

Type of connector

pin strips

Connector

socket

Kind of connector

female

Spatial orientation

straight

Contacts pitch

2.54mm

Electrical mounting

THT

Connector pinout layout

1x18

Gross weight

0.86 g

Operating temperature

-40...163°C

HTS代码

8542.39.00.01

端子位置

DUAL

终端形式

无铅

功能数量

1

端子间距

0.65 mm

Reach合规守则

unknown

Current rating

1.5A

JESD-30代码

R-PDSO-N14

座位高度-最大

1 mm

接口IC类型

电路接口

筛选水平

AEC-Q100

Rated voltage

60V

个人资料

beryllium copper

长度

4.5 mm

宽度

3 mm

Plating thickness

0.254µm

Flammability rating

UL94V-0