NXP USA Inc. 1321XDSK-BDM

Name: 1321XDSK-BDM
Brand: NXP USA Inc.
SKU: 1786-1321XDSK-BDM
Availability: InStock
Rating: 5 (1 reviews)

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对比

型号

1321XDSK-BDM

品牌

NXP USA Inc.

utmel 编号

1786-1321XDSK-BDM

商品类别

射频评估和开发套件，开发板

封装

交货地

大陆

交期（工作日）

立即发货

ROHS

ECAD

简介

MC1321X, ZIGBEE, USB MULTILINK BDM, DEV KIT; Silicon Manufacturer:NXP; Core Architecture:HCS08; Core Sub-Architecture:HCS08; Silicon Core Number:MC13213; Silicon Family Name:MC1321x; No. of Bits:8bit; For Use With:MC1321x Family ;RoHS Compliant: Yes

起订量

1最小包装量--

添加到询价列表

1321XDSK-BDM NXP USA Inc. MC1321X, ZIGBEE, USB MULTILINK BDM, DEV KIT; Silicon Manufacturer:NXP; Core Architecture:HCS08; Core Sub-Architecture:HCS08; Silicon Core Number:MC13213; Silicon Family Name:MC1321x; No. of Bits:8bit; For Use With:MC1321x Family ;RoHS Compliant: Yes

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