NXP USA Inc. 74ALVT16373DGG

表面安装

YES

终端数量

48

Package Description

TSSOP, TSSOP48,.3,20

Package Style

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Moisture Sensitivity Levels

2

Load Capacitance (CL)

50 pF

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

TSSOP48,.3,20

Operating Temperature-Min

-40 °C

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

74ALVT16373DGG

Supply Voltage-Nom (Vsup)

3.3 V

Package Code

TSSOP

Package Shape

RECTANGULAR

Manufacturer

Philips Semiconductors

Part Life Cycle Code

Transferred

Ihs Manufacturer

飞利浦半导体

Risk Rank

5.69

Prop.

4.2 ns

子类别

FF/Latches

技术

BICMOS

端子位置

DUAL

终端形式

鸥翼

功能数量

2

端子间距

0.5 mm

JESD-30代码

R-PDSO-G48

资历状况

不合格

电源

3.3 V

温度等级

INDUSTRIAL

比特数

8

输出特性

3-STATE

逻辑IC类型

D 拉锁

最大 I(ol)

0.064 A

达到SVHC

unknown