NXP USA Inc. 74HC112PW

表面安装

YES

终端数量

16

Package Description

TSSOP, TSSOP16,.25

Package Style

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Load Capacitance (CL)

50 pF

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

TSSOP16,.25

Operating Temperature-Min

-40 °C

Operating Temperature-Max

125 °C

Rohs Code

有

Manufacturer Part Number

74HC112PW

Package Code

TSSOP

Package Shape

RECTANGULAR

Manufacturer

Philips Semiconductors

Part Life Cycle Code

Transferred

Ihs Manufacturer

飞利浦半导体

Max

20000000 Hz

Risk Rank

5.67

子类别

FF/Latches

技术

CMOS

端子位置

DUAL

终端形式

鸥翼

功能数量

2

端子间距

0.635 mm

Reach合规守则

unknown

JESD-30代码

R-PDSO-G16

资历状况

不合格

电源

2/6 V

温度等级

AUTOMOTIVE

逻辑IC类型

J-K FLIP-FLOP

最大 I(ol)

0.004 A

触发器类型

NEGATIVE EDGE