NXP USA Inc. 74HC32DB

表面安装

YES

终端数量

14

Package Description

SSOP, SSOP14,.3

Package Style

SMALL OUTLINE, SHRINK PITCH

Load Capacitance (CL)

50 pF

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

SSOP14,.3

Operating Temperature-Min

-40 °C

Operating Temperature-Max

125 °C

Rohs Code

有

Manufacturer Part Number

74HC32DB

Package Code

SSOP

Package Shape

RECTANGULAR

Manufacturer

Philips Semiconductors

Part Life Cycle Code

Transferred

Ihs Manufacturer

飞利浦半导体

Risk Rank

5.69

Prop.

27 ns

子类别

Gates

包装方式

TUBE

技术

CMOS

端子位置

DUAL

终端形式

鸥翼

端子间距

0.635 mm

Reach合规守则

unknown

JESD-30代码

R-PDSO-G14

资历状况

不合格

电源

2/6 V

温度等级

AUTOMOTIVE

逻辑IC类型

OR GATE

最大 I(ol)

0.004 A

施密特触发器

NO