NXP USA Inc. 74HC58N

表面安装

NO

终端数量

14

Package Description

DIP, DIP14,.3

Package Style

IN-LINE

Load Capacitance (CL)

50 pF

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

DIP14,.3

Operating Temperature-Min

-40 °C

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

74HC58N

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

Philips Semiconductors

Part Life Cycle Code

Transferred

Ihs Manufacturer

飞利浦半导体

Prop.

29 ns

Risk Rank

8.52

子类别

Gates

技术

CMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-PDIP-T14

资历状况

不合格

电源

2/6 V

温度等级

INDUSTRIAL

最大 I(ol)

0.004 A

施密特触发器

NO