NXP USA Inc. 74LVC32APW-T

表面安装

YES

终端数量

14

Package Description

TSSOP, TSSOP14,.25

Package Style

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Moisture Sensitivity Levels

1

Load Capacitance (CL)

50 pF

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

TSSOP14,.25

Operating Temperature-Min

-40 °C

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

74LVC32APW-T

Supply Voltage-Nom (Vsup)

3.3 V

Package Code

TSSOP

Package Shape

RECTANGULAR

Manufacturer

Philips Semiconductors

Part Life Cycle Code

Transferred

Ihs Manufacturer

飞利浦半导体

Risk Rank

8.52

Prop.

5 ns

子类别

Gates

包装方式

TAPE AND REEL

技术

CMOS

端子位置

DUAL

终端形式

鸥翼

端子间距

0.635 mm

Reach合规守则

unknown

JESD-30代码

R-PDSO-G14

资历状况

不合格

电源

3.3 V

温度等级

INDUSTRIAL

逻辑IC类型

OR GATE

最大 I(ol)

0.024 A

施密特触发器

NO