NXP USA Inc. 74LVT08DB

表面安装

YES

终端数量

14

Prop.

4.6 ns

Risk Rank

5.68

Ihs Manufacturer

飞利浦半导体

Part Life Cycle Code

Transferred

Manufacturer

Philips Semiconductors

Package Shape

RECTANGULAR

Package Code

SSOP

Supply Voltage-Nom (Vsup)

3.3 V

Manufacturer Part Number

74LVT08DB

Rohs Code

有

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Equivalence Code

SSOP14,.3

Package Body Material

PLASTIC/EPOXY

Moisture Sensitivity Levels

1

Package Style

SMALL OUTLINE, SHRINK PITCH

Package Description

SSOP, SSOP14,.3

子类别

Gates

技术

BICMOS

端子位置

DUAL

终端形式

鸥翼

端子间距

0.635 mm

Reach合规守则

unknown

JESD-30代码

R-PDSO-G14

资历状况

不合格

电源

3.3 V

温度等级

INDUSTRIAL

逻辑IC类型

AND GATE

最大 I(ol)

0.032 A

施密特触发器

NO