NXP USA Inc. BGS8L3UK

表面安装

YES

终端数量

6

Manufacturer Part Number

BGS8L3UK

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NEXPERIA

Package Description

VFBGA,

Risk Rank

5.84

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

VFBGA

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Supply Voltage-Nom

1.8 V

端子位置

BOTTOM

终端形式

BALL

功能数量

1

端子间距

0.26 mm

Reach合规守则

compliant

JESD-30代码

R-PBGA-B6

温度等级

INDUSTRIAL

座位高度-最大

0.31 mm

通信IC类型

射频和基带电路

长度

0.69 mm

宽度

0.44 mm