NXP USA Inc. ISP1122ABD

表面安装

YES

终端数量

32

Package Description

QFP, QFP32,.35SQ,32

Package Style

FLATPACK

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

QFP32,.35SQ,32

Operating Temperature-Min

-40 °C

Supply Voltage-Nom

5 V

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

ISP1122ABD

Package Code

QFP

Package Shape

SQUARE

Manufacturer

Philips Semiconductors

Part Life Cycle Code

Transferred

Ihs Manufacturer

飞利浦半导体

Risk Rank

5.74

JESD-609代码

e3

端子表面处理

Matte Tin (Sn)

子类别

总线控制器

端子位置

QUAD

终端形式

鸥翼

端子间距

0.8 mm

Reach合规守则

unknown

JESD-30代码

S-PQFP-G32

资历状况

不合格

电源

5 V

温度等级

INDUSTRIAL