NXP USA Inc. ISP1160BD

表面安装

YES

终端数量

64

Package Description

10 X 10 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT-314-2, LQFP-64

Package Style

FLATPACK, LOW PROFILE, FINE PITCH

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Supply Voltage-Nom

3.3 V

Reflow Temperature-Max (s)

40

Supply Voltage-Min

3 V

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

ISP1160BD

Clock Frequency-Max

6 MHz

Package Code

LFQFP

Package Shape

SQUARE

Manufacturer

恩智浦半导体

Part Life Cycle Code

Transferred

Ihs Manufacturer

NXP SEMICONDUCTORS

Supply Voltage-Max

3.6 V

Risk Rank

5.02

Part Package Code

QFP

附加功能

OPERATES AT 5V SUPPLY WITH REGULATOR

技术

CMOS

端子位置

QUAD

终端形式

鸥翼

峰值回流焊温度（摄氏度）

260

端子间距

0.5 mm

Reach合规守则

unknown

引脚数量

64

JESD-30代码

S-PQFP-G64

资历状况

不合格

温度等级

INDUSTRIAL

uPs/uCs/外围ICs类型

BUS CONTROLLER, UNIVERSAL SERIAL BUS

座位高度-最大

1.6 mm

地址总线宽度

1

外部数据总线宽度

16

总线兼容性

SH-3; SH-4; ARM7; ARM9; STRONGARM; MIPS

最大数据传输率

15 MBps

宽度

10 mm

长度

10 mm