NXP USA Inc. ISP1181DGG

表面安装

YES

终端数量

48

Package Description

TSSOP, TSSOP48,.3,20

Package Style

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

TSSOP48,.3,20

Operating Temperature-Min

-40 °C

Operating Temperature-Max

85 °C

Rohs Code

无

Manufacturer Part Number

ISP1181DGG

Package Code

TSSOP

Package Shape

RECTANGULAR

Manufacturer

Philips Semiconductors

Part Life Cycle Code

Transferred

Ihs Manufacturer

飞利浦半导体

Risk Rank

5.84

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

总线控制器

端子位置

DUAL

终端形式

鸥翼

端子间距

0.5 mm

Reach合规守则

unknown

JESD-30代码

R-PDSO-G48

资历状况

不合格

电源

3.3,5 V

温度等级

INDUSTRIAL