OKI Semiconductor MSM82C53-2GS

表面安装

YES

终端数量

32

Package Description

SSOP, SOP32,.47,40

Package Style

SMALL OUTLINE, SHRINK PITCH

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

SOP32,.47,40

Operating Temperature-Min

-40 °C

Operating Temperature-Max

85 °C

Rohs Code

无

Manufacturer Part Number

MSM82C53-2GS

Supply Voltage-Nom (Vsup)

5 V

Package Code

SSOP

Package Shape

RECTANGULAR

Manufacturer

LAPIS Semiconductor Co Ltd

Part Life Cycle Code

Obsolete

Ihs Manufacturer

LAPIS SEMICONDUCTOR CO LTD

Risk Rank

5.87

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

模拟波形生成功能

技术

CMOS

端子位置

DUAL

终端形式

鸥翼

端子间距

1 mm

Reach合规守则

unknown

JESD-30代码

R-PDSO-G32

资历状况

不合格

电源

5 V

温度等级

INDUSTRIAL