ON Semiconductor ASM3P2180AF-08TR

安装类型

Wall - Front Mount - Thru Holes

触点镀层

50 microinches Gold Plate

表面安装

YES

外壳材料

Composite

插入材料

Hard Dielectric

终端数量

8

Contact Materials

Copper Alloy

Insert Arrangement

E2

Service Rating

M

Contact Sizes

38#22D,1#8(Twinax)

Package Description

LEAD FREE, TSSOP-8

Package Style

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Package Body Material

PLASTIC/EPOXY

Supply Voltage-Nom

3.3 V

Supply Voltage-Min

2.8 V

Operating Temperature-Max

70 °C

Manufacturer Part Number

ASM3P2180AF-08TR

Package Code

TSSOP

Package Shape

RECTANGULAR

Manufacturer

Pulsecore Semiconductor

Part Life Cycle Code

Transferred

Ihs Manufacturer

PULSECORE SEMICONDUCTOR

Supply Voltage-Max

3.7 V

Risk Rank

5.75

技术

CMOS

端子位置

DUAL

终端形式

鸥翼

屏蔽/屏蔽

有

端子间距

0.65 mm

Reach合规守则

unknown

JESD-30代码

R-PDSO-G8

资历状况

不合格

触点样式

Socket

温度等级

COMMERCIAL

密封

Meets IP67

uPs/uCs/外围ICs类型

CLOCK GENERATOR, OTHER

座位高度-最大

1.1 mm

主时钟/晶体频率-名

30 MHz

输出时钟频率-最大值

30 MHz

外壳电镀

化学镍

宽度

3 mm

长度

4.4 mm