ON Semiconductor LB1938T-TLM-H

表面安装

YES

终端数量

8

Package Description

TSSOP, TSSOP8,.19

Package Style

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Moisture Sensitivity Levels

3

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

TSSOP8,.19

Operating Temperature-Min

-30 °C

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

LB1938T-TLM-H

Supply Voltage-Nom (Vsup)

3 V

Package Code

TSSOP

Package Shape

RECTANGULAR

Manufacturer

安森美半导体

Part Life Cycle Code

Obsolete

Ihs Manufacturer

ON SEMICONDUCTOR

Risk Rank

5.74

JESD-609代码

e6

端子表面处理

Tin/Bismuth (Sn/Bi)

子类别

Motion Control Electronics

技术

BIPOLAR

端子位置

DUAL

终端形式

鸥翼

端子间距

0.635 mm

Reach合规守则

compliant

JESD-30代码

R-PDSO-G8

资历状况

不合格

电源

3 V

温度等级

OTHER

供应电流-最大值(Isup)

29 mA