ON Semiconductor MC100EP08DTR2

表面安装

YES

终端数量

8

Maximum High Level Output Current (mA)

-50

Minimum Operating Supply Voltage (V)

-3|3

Typical Operating Supply Voltage (V)

-5|5|-3.3|3.3

ECCN (US)

EAR99

HTS

8542.39.00.01

Logic Family

ECL

Number of Elements per Chip

1

Number of Element Inputs

4-IN

Number of Output Enables per Element

0

Number of Selection Inputs per Element

0

Number of Element Outputs

2

Maximum Propagation Delay Time @ Maximum CL (ns)

0.3@3V to 5.5V

Absolute Propagation Delay Time (ns)

0.32

Process Technology

ECL

Maximum Low Level Output Current (mA)

50

Maximum Operating Supply Voltage (V)

-5.5|5.5

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

85

Standard Package Name

SOP

Supplier Package

TSSOP

Mounting

表面贴装

Package Height

0.95(Max)

Package Length

3.1(Max)

Package Width

3.1(Max)

PCB changed

8

Lead Shape

Gull-wing

Package Description

PLASTIC, TSSOP-8

Package Style

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

TSSOP8,.19

Operating Temperature-Min

-40 °C

Reflow Temperature-Max (s)

30

Operating Temperature-Max

85 °C

Rohs Code

无

Manufacturer Part Number

MC100EP08DTR2

Supply Voltage-Nom (Vsup)

3.3 V

Package Code

TSSOP

Package Shape

SQUARE

Manufacturer

安森美半导体

Part Life Cycle Code

Obsolete

Ihs Manufacturer

ON SEMICONDUCTOR

Risk Rank

5.49

Part Package Code

SOIC

Prop.

0.32 ns

包装

卷带

JESD-609代码

e0

零件状态

Obsolete

端子表面处理

Tin/Lead (Sn90Pb10)

附加功能

NECL MODE: 0V VCC WITH VEE = -3.0V TO -5.5V

HTS代码

8542.39.00.01

子类别

Gates

包装方式

TAPE AND REEL

技术

ECL

端子位置

DUAL

终端形式

鸥翼

峰值回流焊温度（摄氏度）

240

功能数量

1

端子间距

0.65 mm

Reach合规守则

not_compliant

引脚数量

8

JESD-30代码

S-PDSO-G8

资历状况

不合格

电源电压-最大值(Vsup)

5.5 V

电源

-4.5 V

温度等级

INDUSTRIAL

电源电压-最小值(Vsup)

3 V

家人

100E

逻辑功能

XOR/XNOR

输入数量

2

座位高度-最大

1.1 mm

逻辑IC类型

XOR/XNOR GATE

传播延迟(tpd)

0.3 ns

施密特触发器

NO

电源电流-最大值(ICC)

40 mA

宽度

3 mm

长度

3 mm

RoHS状态

RoHS non-compliant