ON Semiconductor MC14541BCLDS

表面安装

NO

终端数量

14

Package Description

DIP, DIP14,.3

Package Style

IN-LINE

Package Body Material

CERAMIC

Package Equivalence Code

DIP14,.3

Operating Temperature-Min

-40 °C

Operating Temperature-Max

85 °C

Rohs Code

无

Manufacturer Part Number

MC14541BCLDS

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

飞思卡尔半导体

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MOTOROLA SEMICONDUCTOR PRODUCTS

Risk Rank

5.87

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

模拟波形生成功能

技术

CMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T14

电源

5/15 V

温度等级

INDUSTRIAL