ON Semiconductor MC1660LDS

表面安装

NO

终端数量

16

Package Style

IN-LINE

Package Body Material

CERAMIC

Package Equivalence Code

DIP16,.3

Operating Temperature-Min

-30 °C

Operating Temperature-Max

85 °C

Rohs Code

无

Manufacturer Part Number

MC1660LDS

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

摩托罗拉半导体产品

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MOTOROLA INC

Risk Rank

5.9

Prop.

2.3 ns

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

Gates

技术

ECL

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T16

电源

-5.2 V

温度等级

OTHER

逻辑IC类型

OR/NOR GATE

施密特触发器

NO

电源电流-最大值(ICC)

28 mA