ON Semiconductor MM5627BN

表面安装

NO

终端数量

16

Package Style

IN-LINE

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

DIP16,.3

Operating Temperature-Min

-40 °C

Operating Temperature-Max

85 °C

Rohs Code

无

Manufacturer Part Number

MM5627BN

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

National Semiconductor Corporation

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NATIONAL SEMICONDUCTOR CORP

Risk Rank

8.78

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

FF/Latches

技术

CMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

功能数量

2

端子间距

2.54 mm

Reach合规守则

compliant

JESD-30代码

R-PDIP-T16

资历状况

不合格

电源

5/15 V

温度等级

INDUSTRIAL

逻辑IC类型

J-K FLIP-FLOP

触发器类型

MASTER-SLAVE