Philips NE57605CD

表面安装

YES

终端数量

20

Package Description

TSSOP, TSSOP20,.25

Package Style

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

TSSOP20,.25

Operating Temperature-Min

-20 °C

Operating Temperature-Max

70 °C

Rohs Code

无

Manufacturer Part Number

NE57605CD

Package Code

TSSOP

Package Shape

RECTANGULAR

Manufacturer

Philips Semiconductors

Part Life Cycle Code

Transferred

Ihs Manufacturer

飞利浦半导体

Risk Rank

5.77

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

电源管理电路

端子位置

DUAL

终端形式

鸥翼

端子间距

0.635 mm

Reach合规守则

unknown

JESD-30代码

R-PDSO-G20

资历状况

不合格

温度等级

COMMERCIAL

供应电流-最大值(Isup)

0.11 mA