Philips Semiconductors 74HC191D

表面安装

YES

材料

synthetic polyolefin

终端数量

16

Diameter of protected wire (cable)

21…39 mm

Diameter before shrinkage

41.5 mm

Diameter after shrinkage

20.0 mm

Wall thickness before shrinkage

0.55 mm

Wall thickness after shrinkage

1.0 mm

Gross weight

2910.00

Transport packaging size/quantity

46*46*31/5

Rohs Code

有

Part Life Cycle Code

Transferred

Ihs Manufacturer

飞利浦半导体

Load Capacitance (CL)

50 pF

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

SOP

Package Equivalence Code

SOP16,.25

Package Shape

RECTANGULAR

Package Style

小概要

包装

coil 50 m

JESD-609代码

e4

类型

Non-adhesive heat-shrink tube

端子表面处理

Nickel/Palladium/Gold (Ni/Pd/Au)

颜色

yellow

HTS代码

8542.39.00.01

端子位置

DUAL

终端形式

鸥翼

功能数量

1

端子间距

1.27 mm

Reach合规守则

unknown

JESD-30代码

R-PDSO-G16

资历状况

不合格

温度等级

INDUSTRIAL

Operating temperature range

-55…+125 °C

逻辑IC类型

BINARY COUNTER

最大 I(ol)

0.004 A

Shrink temperature

+70…+120 °C

计数方向

BIDIRECTIONAL

最大频率@Nom-Sup

16000000 Hz

负载/预设输入

YES

操作方式

SYNCHRONOUS

Operating voltage

600 V

收缩率

2 : 1