Philips Semiconductors BAS32

表面安装

YES

材料

synthetic polyolefin

外壳材料

1

Rohs Code

无

Part Life Cycle Code

Transferred

Ihs Manufacturer

飞利浦半导体

Forward Voltage-Max (VF)

0.6 V

Operating Temperature-Max

200 °C

Diameter of protected wire (cable)

4.2…7.2 mm

Diameter before shrinkage

8.5 mm

Diameter after shrinkage

4.0 mm

Wall thickness before shrinkage

0.28 mm

Wall thickness after shrinkage

0.6 mm

Gross weight

1025.00

Transport packaging size/quantity

46*46*50/20

包装

in packs of 1 meter lengths

JESD-609代码

e0

ECCN 代码

EAR99

类型

Adhesive-free heat shrink tubing

端子表面处理

Tin/Lead (Sn/Pb)

颜色

green

Reach合规守则

unknown

配置

SINGLE

二极管类型

接收电极

输出电流-最大值

0.15 A

相位的数量

1

Operating temperature range

-55…+125 °C

Rep Pk反向电压-最大值

75 V

最大非代表Pk前进电流

2 A

Shrinkage ratio

2 : 1

Shrink temperature

+70…+120 °C

Operating voltage

600 V