Philips Semiconductors CBT3257APW

表面安装

YES

终端数量

16

Rohs Code

有

Part Life Cycle Code

Transferred

Ihs Manufacturer

飞利浦半导体

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

TSSOP

Package Equivalence Code

TSSOP16,.25

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Supply Voltage-Nom (Vsup)

5 V

Gross weight

46.08

Transport packaging size/quantity

42*28*18.5/280

Description

Cylindrical lock for box with flat key, plastic handle

Body diameter

18 mm

Bolt type

straight

HTS代码

8542.39.00.01

端子位置

DUAL

终端形式

鸥翼

端子间距

0.635 mm

Reach合规守则

unknown

JESD-30代码

R-PDSO-G16

资历状况

不合格

温度等级

INDUSTRIAL

Body height

20 mm