Philips Semiconductors MAX6400-29UK

表面安装

YES

终端数量

4

Rohs Code

无

Part Life Cycle Code

Transferred

Ihs Manufacturer

飞利浦半导体

Package Description

FBGA, BGA4,2X2,20

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

FBGA

Package Equivalence Code

BGA4,2X2,20

Package Shape

SQUARE

Package Style

GRID ARRAY, FINE PITCH

Threshold Voltage-Nom

+2.93V

JESD-609代码

e0

ECCN 代码

EAR99

端子表面处理

Tin/Lead (Sn/Pb)

HTS代码

8542.39.00.01

端子位置

BOTTOM

终端形式

BALL

端子间距

0.5 mm

Reach合规守则

unknown

JESD-30代码

S-PBGA-B4

资历状况

不合格

温度等级

INDUSTRIAL

可调阈值

NO

供应电流-最大值(Isup)

0.00175 mA