Philips Semiconductors N74F32D

表面安装

YES

材料

synthetic polyolefin

终端数量

14

Rohs Code

有

Part Life Cycle Code

Transferred

Ihs Manufacturer

飞利浦半导体

Operating Temperature-Max

70 °C

Package Body Material

PLASTIC/EPOXY

Package Code

SOP

Package Equivalence Code

SOP14,.25

Package Shape

RECTANGULAR

Package Style

小概要

Supply Voltage-Nom (Vsup)

5 V

Diameter of protected wire (cable)

16…29 mm

Diameter before shrinkage

31.5 mm

Diameter after shrinkage

15.0 mm

Wall thickness before shrinkage

0.55 mm

Wall thickness after shrinkage

0.95 mm

Gross weight

2365.00

Transport packaging size/quantity

46*46*24/10

包装

50m coil

JESD-609代码

e4

类型

Heat shrink tube without adhesive

端子表面处理

Nickel/Palladium/Gold (Ni/Pd/Au)

颜色

black

HTS代码

8542.39.00.01

端子位置

DUAL

终端形式

鸥翼

端子间距

1.27 mm

Reach合规守则

unknown

JESD-30代码

R-PDSO-G14

资历状况

不合格

温度等级

COMMERCIAL

Operating temperature range

-55…+125 °C

逻辑IC类型

OR GATE

最大 I(ol)

0.02 A

Prop. Delay@Nom-Sup

6.6 ns

施密特触发器

NO

电源电流-最大值(ICC)

15.5 mA

Shrink temperature

+70…+120 °C

Operating voltage

600 V

Shrink ratio

2 : 1