Philips Semiconductors PCF8574P

表面安装

NO

终端数量

16

Gross Weight

28.30

Transport Package size/quantity

48*31.5*27/150

Noal Current

5Amin

Mounting Hole Size

23.5mm

Switching Scheme

no(nc)+nc(no)

Button Shape/Color

rectangle/blue

Dielectric Strength

1500 (50Hz, 1 min.) V

Presence and Type of Backlight

LED 12V

Number of Switching Cycles (electrical)

10000 min

Rohs Code

有

Part Life Cycle Code

Transferred

Ihs Manufacturer

飞利浦半导体

Package Description

DIP-16

Number of I/O Lines

8

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

DIP

Package Equivalence Code

DIP16,.3

Package Shape

RECTANGULAR

Package Style

IN-LINE

JESD-609代码

e4

ECCN 代码

EAR99

端子表面处理

镍钯金

HTS代码

8542.39.00.01

端子位置

DUAL

终端形式

THROUGH-HOLE

峰值回流焊温度（摄氏度）

245

端子间距

2.54 mm

深度

69.3mm

Reach合规守则

unknown

JESD-30代码

R-PDIP-T16

资历状况

不合格

触点电阻

30 mOhm max

温度等级

INDUSTRIAL

绝缘电阻

1000 (at Uins.dc=500 V) MOhm min

端口的数量

1

uPs/uCs/外围ICs类型

PARALLEL IO PORT, GENERAL PURPOSE

比特数

8

工作温度范围

-25…+85°C

切换电压

125/250 (AC) V

高度

32.8mm

宽度

32.8mm