Philips Semiconductors SA604N

表面安装

NO

终端数量

16

Rohs Code

无

Part Life Cycle Code

Obsolete

Ihs Manufacturer

飞利浦半导体

Package Style

IN-LINE

Package Shape

RECTANGULAR

Package Equivalence Code

DIP16,.3

Package Code

DIP

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Operating Temperature-Max

85 °C

Package Description

DIP-16

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

HTS代码

8542.39.00.01

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-PDIP-T16

资历状况

不合格

温度等级

INDUSTRIAL

电源电流-最大值

2.7 mA