Philips Semicons 1DDD381AA-M02
- 收藏
- 对比
1DDD381AA-M02
1891-1DDD381AA-M02
集成电路(IC)
--
大陆
立即发货

1DDD381AA-M02 datasheet pdf and Integrated Circuits (ICs) product details from Philips Semicons stock available at utmel
1最小包装量--
1DDD381AA-M02详情
Philips Semicons 1DDD381AA-M02重要参数规格及、参数值,及相似型号如下:
- 参数名参数值全选
- 参数名参数值全选
表面安装
YES
终端数量
8
Manufacturer Part Number
1DDD381AA-M02
Rohs Code
无
Part Life Cycle Code
Obsolete
Ihs Manufacturer
ROGERS CORP DUREL DIVISION
Package Description
TSSOP, TSSOP8,.19
Risk Rank
5.88
Moisture Sensitivity Levels
1
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
Package Code
TSSOP
Package Equivalence Code
TSSOP8,.19
Package Shape
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
JESD-609代码
e0
端子表面处理
Tin/Lead (Sn/Pb)
端子位置
DUAL
终端形式
鸥翼
端子间距
0.635 mm
Reach合规守则
unknown
JESD-30代码
R-PDSO-G8
资历状况
不合格
温度等级
INDUSTRIAL
1DDD381AA-M02拓展信息
Philips Semicons
Philips Semicons
Philips Semicons
Philips Semicons
Philips Semicons
Philips Semicons
Philips Semicons
Philips Semicons
Philips Semicons
Philips Semicons







哦! 它是空的。