Philips Semicons 2692/BUA

表面安装

YES

终端数量

44

Manufacturer Part Number

2692/BUA

Rohs Code

无

Part Life Cycle Code

Transferred

Ihs Manufacturer

飞利浦半导体

Package Description

QCCN, LCC44,.65SQ

Risk Rank

8.68

Operating Temperature-Max

125 °C

Operating Temperature-Min

-55 °C

Package Body Material

CERAMIC

Package Code

QCCN

Package Equivalence Code

LCC44,.65SQ

Package Shape

SQUARE

Package Style

CHIP CARRIER

Supply Voltage-Nom

5 V

Usage Level

Military grade

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

端子位置

QUAD

终端形式

无铅

端子间距

1.27 mm

Reach合规守则

unknown

JESD-30代码

S-XQCC-N44

资历状况

不合格

电源

5 V

温度等级

MILITARY

uPs/uCs/外围ICs类型

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

筛选水平

38535Q/M;38534H;883B