Philips Semicons 74LVC157APW-T

表面安装

YES

终端数量

16

Manufacturer Part Number

74LVC157APW-T

Rohs Code

有

Part Life Cycle Code

Transferred

Ihs Manufacturer

飞利浦半导体

Package Description

TSSOP, TSSOP16,.25

Risk Rank

7.98

Load Capacitance (CL)

50 pF

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

TSSOP

Package Equivalence Code

TSSOP16,.25

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Prop.

5.7 ns

Supply Voltage-Nom (Vsup)

3.3 V

包装方式

TAPE AND REEL

端子位置

DUAL

终端形式

鸥翼

功能数量

4

端子间距

0.635 mm

Reach合规守则

unknown

JESD-30代码

R-PDSO-G16

资历状况

不合格

电源

3.3 V

温度等级

INDUSTRIAL

输入数量

2

逻辑IC类型

MULTIPLEXER

最大 I(ol)

0.024 A