Qualcomm IP2022/PQ80-120U

表面安装

YES

终端数量

80

Gross weight

0.90

Transport packaging size/quantity

48*32*27/15000

Wire cross-section

AWG26

Mounting method

crimping / soldering

Contact pitch

2.00 mm

Rohs Code

有

Part Life Cycle Code

Obsolete

Ihs Manufacturer

QUALCOMM INC

Package Description

QFP,

Supply Voltage-Nom

2.5 V

Supply Voltage-Min

2.3 V

Supply Voltage-Max

2.7 V

Package Style

FLATPACK

Package Shape

RECTANGULAR

Package Code

QFP

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Operating Temperature-Max

85 °C

HTS代码

8542.31.00.01

端子位置

QUAD

终端形式

鸥翼

峰值回流焊温度（摄氏度）

未说明

端子间距

0.8 mm

Reach合规守则

unknown

时间@峰值回流温度-最大值(s)

未说明

Insulation color

green

JESD-30代码

R-PQFP-G80

Number of contacts

1

温度等级

INDUSTRIAL

uPs/uCs/外围ICs类型

微处理器电路

座位高度-最大

3.4 mm

Operating temperature range

-25…+85 °C

宽度

14 mm

长度

20 mm