Renesas ISP1362EEUM

表面安装

YES

终端数量

64

Package Description

TFBGA, BGA64,10X10,20

Package Style

GRID ARRAY, THIN PROFILE, FINE PITCH

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

BGA64,10X10,20

Manufacturer Package Code

SOT543-1

Operating Temperature-Min

-40 °C

Supply Voltage-Nom

3.3 V

Supply Voltage-Min

3 V

Operating Temperature-Max

85 °C

Manufacturer Part Number

ISP1362EEUM

Clock Frequency-Max

12 MHz

Package Code

TFBGA

Package Shape

SQUARE

Manufacturer

ST-Ericsson

Part Life Cycle Code

Obsolete

Ihs Manufacturer

ST-ERICSSON

Supply Voltage-Max

3.6 V

Risk Rank

5.45

Part Package Code

BGA

子类别

总线控制器

技术

CMOS

端子位置

BOTTOM

终端形式

BALL

端子间距

0.5 mm

Reach合规守则

unknown

引脚数量

64

JESD-30代码

S-PBGA-B64

资历状况

不合格

电源

3.3 V

温度等级

INDUSTRIAL

uPs/uCs/外围ICs类型

BUS CONTROLLER, UNIVERSAL SERIAL BUS

座位高度-最大

1.1 mm

外部数据总线宽度

16

总线兼容性

SH-3; STRONGARM; XA; SPARCLITE; MIPS; ARM7; ARM9; DRAGONBALL; POWERPC

最大数据传输率

10 MBps

宽度

6 mm

长度

6 mm