Renesas MC-242443F9-B10-BS1

表面安装

YES

终端数量

71

Package Description

FBGA, BGA71,8X12,32

Package Style

GRID ARRAY, FINE PITCH

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

BGA71,8X12,32

Operating Temperature-Min

-20 °C

Access Time-Max

100 ns

Operating Temperature-Max

70 °C

Manufacturer Part Number

MC-242443F9-B10-BS1

Package Code

FBGA

Package Shape

RECTANGULAR

Manufacturer

Renesas Electronics Corporation

Part Life Cycle Code

Obsolete

Ihs Manufacturer

RENESAS ELECTRONICS CORP

Risk Rank

5.84

子类别

其他存储器集成电路

技术

HYBRID

端子位置

BOTTOM

终端形式

BALL

端子间距

0.8 mm

JESD-30代码

R-PBGA-B71

资历状况

不合格

电源

2.6/3 V

温度等级

COMMERCIAL

电源电流-最大值

0.045 mA

待机电流-最大值

0.00001 A

内存IC类型

存储器电路

混合内存类型

FLASH+SRAM

达到SVHC

unknown