参数名
参数值
参数名
参数值
安装类型
表面贴装
包装/外壳
176-LFBGA
供应商器件包装
176-LFBGA (13x13)
Overload Pressure (Max)
0.5BAR
Package Type
DIP MODULE
Operating Temp Range
-40C to 85C
Operating Supply Voltage (Max)
3.6(V)
Operating Supply Voltage (Typ)
3.3(V)
Rad Hardened
无
Operating Supply Voltage (Min)
3(V)
Mounting
通孔
Moisture Sensitive
有
Shipping Restrictions
This product may require additional documentation to export from the United States.
Factory Pack QuantityFactory Pack Quantity
25
Manufacturer
Renesas Electronics
Brand
Renesas Electronics
RoHS
Details
Number of I/Os
133
Package
Tray
Base Product Number
R7FA6M5
厂商
Renesas Electronics America Inc
Data Converters
A/D 29x12b SAR; D/A 2x12b
Product Status
活跃
系列
RA6M5
包装
Tray
操作温度
-40°C ~ 105°C (TA)
类型
Differential
子类别
Microcontrollers - MCU
引脚数量
8
振荡器类型
External, Internal
速度
200MHz
内存大小
512K x 8
电压 - 供电 (Vcc/Vdd)
2.7V ~ 3.6V
核心处理器
ARM® Cortex®-M33
周边设备
DMA, LVD, POR, PWM, WDT
程序存储器类型
FLASH
芯尺寸
32-Bit Single-Core
程序内存大小
1.5MB (1.5M x 8)
连接方式
CANbus, Ethernet, I²C, MMC/SD, SCI, SPI, QSPI, UART/USART, USB
产品类别
ARM Microcontrollers - MCU
EEPROM 大小
8K x 8
压力范围
-0.1BAR TO 0.1BAR
产品类别
ARM Microcontrollers - MCU