Renesas UPD7811G-36

表面安装

NO

终端数量

64

RoHS-compliant

有

Connections

Solder bucket

Manufacturer part #

MHDM15-DB15P-K

Connection angle

180°

Content

1pc(s)

No. of rows

2

Package Style

IN-LINE

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

QUIP64A,.7/.9

Operating Temperature-Min

-10 °C

Supply Voltage-Nom

5 V

Operating Temperature-Max

70 °C

Rohs Code

无

Manufacturer Part Number

UPD7811G-36

RAM(byte)

256

Package Code

QIP

Package Shape

RECTANGULAR

Manufacturer

Renesas Electronics Corporation

ROM(word)

4096

Part Life Cycle Code

Obsolete

Ihs Manufacturer

RENESAS ELECTRONICS CORP

Risk Rank

5.92

JESD-609代码

e0

类型

MHDM15-DB15P-K

端子表面处理

Tin/Lead (Sn/Pb)

子类别

Microcontrollers

技术

MOS

端子位置

QUAD

终端形式

PIN/PEG

端子间距

1.27 mm

Reach合规守则

unknown

JESD-30代码

R-PQIP-P64

资历状况

不合格

电源

5 V

温度等级

COMMERCIAL

速度

12 MHz

电源电流-最大值

235 mA

位元大小

16

只读存储器可编程性

MROM

特征

Enclosure,+ 4-40 knurl head screw,+ strain relief clip,+ cable sleeve,+ metal enclosure