参数名
参数值
参数名
参数值
表面安装
YES
终端数量
100
Lead Shape
Gull-wing
PCB changed
100
Package Width
14
Package Length
14
Package Height
2.7
Mounting
表面贴装
Supplier Package
PQFP
Standard Package Name
QFP
CECC Qualified
无
Supplier Temperature Grade
Industrial
Maximum Operating Temperature (°C)
75
Minimum Operating Temperature (°C)
-20
Maximum Operating Supply Voltage (V)
5.5
Typical Operating Supply Voltage (V)
5
Minimum Operating Supply Voltage (V)
4
ADC Resolution (bit)
8
Number of ADCs
Single
No. of Timers
5
Number of I/Os
71
Interface Type
SCI
Programmability
有
Maximum Expanded Memory Size
64KB
Data Bus Width (bit)
16
Maximum Clock Rate (MHz)
5
Maximum CPU Frequency (MHz)
5
Instruction Set Architecture
CISC
Family Name
H8
ECCN (US)
EAR99
Package Description
FQFP, QFP100,.63SQ,20
Package Style
FLATPACK, FINE PITCH
Package Body Material
PLASTIC/EPOXY
Package Equivalence Code
QFP100,.63SQ,20
Operating Temperature-Min
-20 °C
Supply Voltage-Nom
5 V
Reflow Temperature-Max (s)
未说明
Supply Voltage-Min
4 V
Operating Temperature-Max
75 °C
Rohs Code
无
Manufacturer Part Number
HD6473834H
RAM(byte)
1024
Clock Frequency-Max
10 MHz
Package Code
FQFP
Package Shape
SQUARE
Manufacturer
Renesas Electronics Corporation
ROM(word)
32768
Part Life Cycle Code
Obsolete
Number of I/O Lines
84
Ihs Manufacturer
RENESAS TECHNOLOGY CORP
Supply Voltage-Max
5.5 V
Risk Rank
5.41
Part Package Code
QFP
JESD-609代码
e0
无铅代码
无
零件状态
Obsolete
端子表面处理
Tin/Lead (Sn/Pb)
附加功能
OPERATES AT 2.7V MINIMUM SUPPLY @ 2.5 MHZ
HTS代码
8542.31.00.01
子类别
Microcontrollers
技术
CMOS
端子位置
QUAD
终端形式
鸥翼
峰值回流焊温度(摄氏度)
未说明
端子间距
0.5 mm
Reach合规守则
unknown
引脚数量
100
JESD-30代码
S-PQFP-G100
资历状况
不合格
电源
3/5 V
温度等级
商业扩展
速度
5 MHz
内存大小
1KB
uPs/uCs/外围ICs类型
MICROCONTROLLER
程序存储器类型
EPROM
程序内存大小
32KB
电源电流-最大值
24 mA
位元大小
8
有ADC
YES
DMA 通道
NO
脉宽调制通道
YES
数模转换器通道
NO
座位高度-最大
3.05 mm
处理器系列
H8/300L
只读存储器可编程性
OTPROM
ADC Channels
12
宽度
14 mm
长度
14 mm
RoHS状态
RoHS non-compliant